Dom> Blog> chip making process

chip making process

April 26, 2022

The chip generally refers to the carrier of the integrated circuit, and it is also the result of the design, manufacture, packaging, and testing of the integrated circuit. It is usually an independent whole that can be used immediately. If the central processing unit (CPU) is likened to the heart of the entire computer system, then the chipset on the motherboard is the torso of the entire body. For the motherboard, the chipset almost determines the function of the motherboard, which in turn affects the performance of the entire computer system. The chipset is the soul of the motherboard. The manufacturing process of the chip can be roughly divided into the wafer processing process (Wafer Fabrication), There are several steps such as Wafer Probe, Packaging, and Initial Test and Final Test. Among them, the wafer processing process and the wafer needle testing process are the front end processes, while the assembly process and the testing process are the back end processes.

Skontaktuj się z nami

Author:

Ms. Zoe Zhong

Phone/WhatsApp:

+86 18617178558

Wszystkie produkty
You may also like
Related Categories

Wyślij je do tym dostawcy

Przedmiot:
Email:
wiadomość:

Your message must be betwwen 20-8000 characters

Skontaktować

  • Tel: 86-186-17178558
  • Whatsapp: +86 18617178558
  • Email: sales07@ynxantenna.com
  • Adres: Room #101,201,301,5BLDG , No.4 of XinWuCun New Area ,Shabo community Maluan Street Pingshan District, Shenzhen ,Guangdong , China, Shenzhen, Guangdong China

Send Inquiry

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Wysłać